Preventing Static Electricity (ESD) and Protecting Products
In the cleanrooms of microelectronics manufacturing, to prevent ESD from occurring on ESD-sensitive components or PCBs, one method is to provide appropriate grounding or shunts to dissipate static charge. Another method is to use appropriate packaging methods and materials for the packaging and transportation of ESD-sensitive devices. These materials effectively shield products from charge intrusion and reduce static charge generation during product movement within the packaging.
Internationally, the semiconductor, flat panel LCD, and optoelectronics industries are developing rapidly, with increasingly higher integration levels and thinner chip wire diameters, leading to increasingly stringent ESD protection requirements. The US ESD Association has begun revising the ANS ESD S 20.20-1999 electrostatic discharge control guidelines, making some modifications to the ESD sensitivity classification of SSDs.
This serves as a warning to component users, informing them of the necessary environmental control requirements during personnel and equipment manufacturing. If EPA-permitted voltages reach 25V, our existing ESD protection equipment, tools, and engineering will likely require significant effort.