Knowledge of electrostatic protection in the semiconductor industry
Basic knowledge of static electricity prevention in the semiconductor industry:
The method of static electricity generation: contact-separation; friction; peeling; conduction.
Safety first: Whether anti-static measures conflict with safety measures.
Protection measures: grounding-equipotential connection; static power control; anti-static packaging.
Key points of concern: product electrostatic sensitivity requirements; protection standard matching; compliance verification.
When to use metal materials and when to use static dissipative materials?
metallic material:
1. Metal materials can be used directly when the product is at equal potential.
2. Metal materials can be used when a single product will not directly contact with metal materials.
Due to the entire product processing framework, the wafers use non-anti-static film, and some equipment cannot be equipped with an ion fan. Static electricity will accumulate during the process. In addition to installing an ion fan, we will choose some fast conductive materials to make the static electricity fast Guide away.
Is it okay if static dissipative materials are used?
Yes, but static electricity dissipates very slowly, there is a risk of static electricity accumulation, and discharge will occur during cutting, which poses a great risk of ESD damage to the product.
Electrostatic material: After cutting and separating a single product, shipping and packaging products, electrostatic materials can be used.
What are the risks of using the wrong materials?
Since the products after cutting and separation are more sensitive and weak in anti-static ability, if metal materials are used, they will cause ESD damage to the product due to too fast conduction (due to rapid discharge after direct contact with the product), and the use of electrostatic materials will limit the pressure. Reduce the risk of ESD damage to the product after contact with the product.
Electrostatic protection measures in the semiconductor industry
Grounding-equipotential connection: the conductor in contact with the sensitive device realizes equipotential connection to avoid discharge due to static electricity on the conductor.
Static power control: The static electricity of insulating materials cannot be eliminated through grounding and equipotential connection, so static power control must be performed around sensitive devices.
Anti-static packaging: Devices shipped out of the ESD protection area must use anti-static packaging to prevent the influence of external static electricity.
The core of static protection is static elimination: prevent static electricity from accumulating where static electricity may occur. We take it to generate and discharge static electricity. And control the electrostatic voltage in a safe range. Eliminate the existing static electricity accumulation and release it in time.