The Impact of ESD on IC Card Module Packaging
The IC card module is the core of an IC card and represents a form of integrated circuit packaging. The basic manufacturing process of an IC card module is very similar to that of conventional integrated circuit packaging, consisting of die bonding, wire bonding, encapsulation, and testing.
The integrated circuit chips packaged in IC card modules represent the culmination of miniaturization and high integration in integrated circuit technology. Due to the micrometer-level spacing between devices, the impact of ESD is particularly pronounced; once electrostatic discharge (ESD) causes a breakdown, the consequences are severe. Although circuit designers can employ necessary protective devices, the accumulation of static electricity on production equipment, in the production environment, and on operators still presents the possibility of short circuits on the silicon wafer and during packaging, damaging device performance and leading to a decrease in yield.
