How to Remove Static Electricity from Chip Placement Machines
Chip placement machines are prone to attracting dust due to static electricity, leading to product defects. The SL-001 micro ion blower can be installed inside the machine.
As core equipment in SMT (surface mount technology) production lines, chip placement machines require comprehensive ESD protection measures, including environmental control, equipment grounding, and personnel operations. The following are specific solutions:
1. Humidity Control
Use a dry mist humidifier to maintain a stable workshop humidity between 45% and 55%. Water molecules form a conductive film on the surface of components, accelerating static electricity discharge. Ultrafine mist particles (5-10 microns) prevent moisture from forming on the equipment, while negative oxygen ions neutralize positive charges in the air.
2. Equipment Grounding and Static Discharge
Equipment Grounding: Placement machines, reflow soldering machines, and other equipment require grounding wires to conduct static electricity to the ground to prevent charge accumulation.
Static Discharge Materials: Use static subconductors (such as rubber containing conductive carbon black) with a surface resistivity of 1×10^6-1×10^9Ω instead of metal conductors to prevent component damage.
III. Personal Protection and Operating Standards
Wear anti-static clothing, shoes, and wristbands. Conduct static electricity from your body into the grounding system using conductive fibers or wires.
Touch a metal object before operation to discharge static electricity. Avoid direct contact with sensitive components.
00:02 Discharging static electricity from metal-cased equipment
00:08 Managing static electricity on mobile phone screens
00:12 Daily preventive measures
00:19 Anti-static tips before plugging and unplugging USB devices
IV. Application of auxiliary equipment
Ion blowers: Neutralize charges in static-prone areas such as placement rails.
Static detectors: Monitor and alert abnormal potentials in real time, enabling prompt investigation of grounding or protection issues.
V. Packaging and transportation protection
Use anti-static packaging bags and turnover boxes containing antistatic agents to reduce the risk of triboelectric charging.
The above measures can systematically address static electricity issues in chip placement machines and keep the defective rate below 5%.