When packaging products containing SSD, especially when the printed circuit board is separated from the whole machine, the electrostatic protection problem should be taken seriously. The same applies to the protection of components containing SSD and the whole package. The following considerations and considerations should be taken when carrying out the above packaging:
(1) The adoption of multiple protective packaging processes.
(2) Application of anti-static, conductive and electrostatic shielding bags and tube film sheets.
(3) Selection of antistatic packaging materials for reproducible use.
(4), anti-static file packaging.
(5), anti-static cleaning package.
(6), anti-static, conductive foam rubber materials.
(7) Use of anti-static component box/layered sheet/layered cover.
(8) Use of special function packaging (earthquake resistance, high and low temperature resistance, etc.).
(9), the use of anti-static tape.
(10), the application of static warning symbols.
