The most common cause of electrostatic damage to sensitive components
Hand coverage
Ordinary plastic, even pink antistatic or black conductive finger cots, gloves have a notorious historical charging "public service electronic" program project, especially the insulating part of printed circuit boards. Many people believe that no material will become the contact of pink anti-static black conductive finger sleeves or gloves when charging. In fact, most PCB materials charge an incredibly high amount of hand coverage, even when the ESD is safe, in contact with bare skin. When the product starts charging, this is a CDM waiting for a failure.
1.1 Ungrounded operators, take ESD projects
Even if the plastic side of the printed circuit board is held, the operator often collects the components when transported. This causes the CDM to fail when the PCB is discharged.
2 With the ESDS project in the opening of bags, boxes, pallets and containers, ungrounded operators
The principle of the Faraday container really works. The ESDS project opens an electrostatic shielding bag when various damages occur. The conductive container has no lid and is transported by a metal tray without a lid.
3 Ungrounded shopping cart on transported ESDS project
ESDS products can become highly charged if there is no proper Faraday shield stored and transported in an ungrounded shopping cart. The failure of the CDM is often a result.
4 ESDS projects on the NonESD surface
It is very important to have ESD protection pads and laminates for ESDS products. It is easy to get a product on a nonESD safe surface, especially in low humidity conditions.
5 charge generating container
We are still surprised to go and seem to have excellent ESD control before we discover that ESDS products produce high-charge containers inside, as part of a standard processing practice, routinely placed at the base. The main offenders include quartz boats and Teflon containers.
6 anti-static packaging for the elderly
Many antistatic materials, especially those that acquire their chemical properties during loading, lose their noncharge performance over time. They will restore the charge generating material. When the protection is lost, the inside ESDS products become charged, causing damage multiple times, the operator releases them and they are removed from the package.
7 blow operation
All air blowout operations should be checked periodically to determine if they cause the ESDS data to become charged during the operational period. Many times, a simple on-site instrument inspection can alert the auditor that such significant damage can be avoided. We have seen significant damage due to this problem.
8 conformal coating
Our files are loaded and the conformal coating application is damaged by the product account. Most conformal coatings charge ESDS projects in significant applications. Discharge and subsequent losses are common.
9 IC processing program
We spent a considerable amount of time detecting and eliminating CDM revenue losses due to the internal workings of modern IC processing equipment. For example, an IC can become part of the normal operation, deducting the internals, while these machines move and slide, then discharge, damage, and normal operation. A lot of expertise and special measuring equipment are needed to detect and eliminate these problems.
10 IC tube IC processing program
This is a very serious problem, but in the past it was decreasing as more and more IC handlers used tapes and reels instead of IC tubes. Historically, clear, anti-static IC straight tubes will lose their ESD performance, causing them to charge within the IC as time goes by, as they slip out. The integrated circuit will be the input slot for the metal processing equipment that is in contact at the time of discharge.
11 Tape and Reel Assembly
The problem continues to use the tape and reel components to charge the ESDS IC handler on the reel.
12 semiconductor wafer container
A major ESD failure mode is created when the ESDS wafer is placed in a highly charged container, part of the normal processing. The inductive charging of the wafer rests in a plastic container and can then be discharged from the mechanism, including host operator contact, hand or tweezers or other wafer gripping equipment, mechanical parts, or conductive containers.